Analysis Services
We identify the root causes of defects in electronic components and materials through non-destructive, precision analysis such as X-Ray and SEM, supporting quality improvement.
- Test Items
- 6
- Standards
- 3
- Equipment
- 6
Service Overview
ATL's Analysis Services use precision analytical equipment such as X-Ray (non-destructive) and scanning electron microscopy (SEM/EDS) to scientifically identify the causes of defects in electronic components and materials.
We perform staged non-destructive and destructive analysis covering internal solder conditions of BGA, CSP, and QFN packages, voids, cracks, and foreign matter, down to cross-sectional microstructure.
By providing reliability test analysis (quality evaluation of automotive electronic components, electronic and mechanical parts) together with sample preparation (cutting, mounting, polishing) as an integrated service, we deliver an objective basis for quality improvement.
Key Test Items
Core testing and evaluation items specific to this field.
Applicable Standards
Delivering objective test results based on international and domestic standards.
- Failure Analysis (FA)
- Root cause identification referencing semiconductor failure mode analysis methods such as JEDEC (JESD22)
- Cross-section Analysis
- Referencing cross-section microstructure evaluation procedures such as IPC-TM-650
- Composition Analysis
- Referencing quantitative EDS composition analysis guidelines such as ASTM E1508
Equipment
Precision-calibrated test facilities that produce accurate, reliable data.
X-Ray Inspection System
Non-destructive internal transmission inspection
Non-destructively inspects internal solder conditions of BGA/CSP/QFN, voids, cracks, foreign matter, and PCB short/open circuits.
Scanning Electron Microscope (SEM/EDS)
Magnification 30–250,000x, resolution 5nm
Performs microstructure observation and elemental composition analysis using SEI/BSE detectors and EDS.
Ion Sputter Coater
Au/Pt thin-film coating
Sample-preparation equipment that applies a conductive thin film for SEM observation.
Precision Cutting Machine
Cutting blade 0.2–0.3in, 0–1,200 RPM
A sample-cutting machine that precisely cuts PCBs of 0.5t or thicker and high-hardness materials.
Automatic Polishing Machine
50–500 RPM, head 0–150 RPM
Automatic polishing equipment that uniformly polishes cross-section samples.
Manual Polishing Machine
#120–#4000, fine polishing 1/3/6nm
Equipment that finishes cross-section samples through staged sandpaper and precision polishing.
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ATL's expert engineers provide reliability testing for automotive electronics, defense, and IT products. Request a quote online or call us.